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CHIP SCALE PACKAGE CSP Design Materials Processes Reliability and Applications McGrawHill Electronic Packaging and Interconnection Series John H Lau Ricky SW Lee eBook Kostenlose Bücher UCN

CHIP SCALE PACKAGE CSP Design Materials Processes Reliability and Applications McGrawHill Electronic Packaging and Interconnection Series John H Lau Ricky SW Lee eBook Kostenlose Bücher CHIP%20SCALE%20PACKAGE%20CSP%20Design%20Materials%20Processes%20Reliability%20and%20Applications%20McGrawHill%20Electronic%20Packaging%20and%20Interconnection%20Series%20John%20H%20Lau%20Ricky%20SW%20Lee%20eBook

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CHIP%20SCALE%20PACKAGE%20CSP%20Design%20Materials%20Processes%20Reliability%20and%20Applications%20McGrawHill%20Electronic%20Packaging%20and%20Interconnection%20Series%20John%20H%20Lau%20Ricky%20SW%20Lee%20eBook

Kostenlose Bücher CHIP SCALE PACKAGE CSP Design Materials Processes Reliability and Applications McGrawHill Electronic Packaging and Interconnection Series John H Lau Ricky SW Lee eBook UCN

Das Geheimnis um Alva German Edition eBook Norbert Löffler Raimund Löffler Kostenloser PDF Reader ORM

The first comprehensive, in-depth guide to chip scale packaging, this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT). Featuring the latest design techniques, plus details on more than 40 different types of CSP, Chip Scale Package hands engineers and designers the complete, professional set of working tools that they need to solve technical and design issues; find the most efficient, cost-effective CSP solutions for their deployments; answer questions on interfacing, speed, robustness, and more; compare properties of wirebonds, flip chips, rigid and flex substrates, wafer-level redistribution, and other CSP products; get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM, Matushita, Motorola, National Semiconductor, NEC, Sharp, Sony, Toshiba, Amkor, TT, LG Semicon, Mitsubishi, Shell Case, Tessera, Samsung, and other major companies; and learn about CSP products under development. A revolution in electronics, CSP is taking the electronics industry by storm. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. No matter how you use Chip Scale Package, youÕll see why itÕs the resource of choice for those who want to be at the top of the game.
ebook,John H. Lau, Ricky S.W. Lee,CHIP SCALE PACKAGE, CSP Design, Materials, Processes, Reliability, and Applications (McGraw-Hill Electronic Packaging and Interconnection Series),McGraw-Hill Education,Electronics - Circuits - Integrated,Electronics - Microelectronics,Design and construction,Electrical engineering,Electricity,Electronics - Circuits - General,Electronics - Circuits - Integrated,Electronics - Microelectronics,INTEGRATED CIRCUITS,Industrial Design - Packaging,Integrated circuits;Design and construction.,MICROELECTRONICS,Microelectronic packaging,Microelectronic packaging.,Non-Fiction,Professional,Science/Math,Science/Mathematics,TECHNOLOGY ENGINEERING / Electronics / Circuits / Integrated,TECHNOLOGY ENGINEERING / Electronics / Microelectronics,TEXT,Technology Engineering,Technology Engineering / Electronics / General,Technology Industrial Arts,United States,Electricity,Electronics - Circuits - General,Industrial Design - Packaging,TECHNOLOGY ENGINEERING / Electronics / Circuits / Integrated,TECHNOLOGY ENGINEERING / Electronics / Microelectronics,Technology Engineering / Electronics / General,Technology Industrial Arts,Integrated Circuits,Microelectronics,Design and construction,Microelectronic packaging,Technology Engineering,Science/Mathematics,Electrical engineering

CHIP SCALE PACKAGE CSP Design Materials Processes Reliability and Applications McGrawHill Electronic Packaging and Interconnection Series John H Lau Ricky SW Lee eBook Reviews :

The first comprehensive, in-depth guide to chip scale packaging, this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT). Featuring the latest design techniques, plus details on more than 40 different types of CSP, Chip Scale Package hands engineers and designers the complete, professional set of working tools that they need to solve technical and design issues; find the most efficient, cost-effective CSP solutions for their deployments; answer questions on interfacing, speed, robustness, and more; compare properties of wirebonds, flip chips, rigid and flex substrates, wafer-level redistribution, and other CSP products; get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM, Matushita, Motorola, National Semiconductor, NEC, Sharp, Sony, Toshiba, Amkor, TT, LG Semicon, Mitsubishi, Shell Case, Tessera, Samsung, and other major companies; and learn about CSP products under development. A revolution in electronics, CSP is taking the electronics industry by storm. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. No matter how you use Chip Scale Package, youÕll see why itÕs the resource of choice for those who want to be at the top of the game.

ebook,John H. Lau, Ricky S.W. Lee,CHIP SCALE PACKAGE, CSP Design, Materials, Processes, Reliability, and Applications (McGraw-Hill Electronic Packaging and Interconnection Series),McGraw-Hill Education,Electronics - Circuits - Integrated,Electronics - Microelectronics,Design and construction,Electrical engineering,Electricity,Electronics - Circuits - General,Electronics - Circuits - Integrated,Electronics - Microelectronics,INTEGRATED CIRCUITS,Industrial Design - Packaging,Integrated circuits;Design and construction.,MICROELECTRONICS,Microelectronic packaging,Microelectronic packaging.,Non-Fiction,Professional,Science/Math,Science/Mathematics,TECHNOLOGY ENGINEERING / Electronics / Circuits / Integrated,TECHNOLOGY ENGINEERING / Electronics / Microelectronics,TEXT,Technology Engineering,Technology Engineering / Electronics / General,Technology Industrial Arts,United States,Electricity,Electronics - Circuits - General,Industrial Design - Packaging,TECHNOLOGY ENGINEERING / Electronics / Circuits / Integrated,TECHNOLOGY ENGINEERING / Electronics / Microelectronics,Technology Engineering / Electronics / General,Technology Industrial Arts,Integrated Circuits,Microelectronics,Design and construction,Microelectronic packaging,Technology Engineering,Science/Mathematics,Electrical engineering

CHIP SCALE PACKAGE, CSP Design, Materials, Processes, Reliability, and Applications (McGraw-Hill Electronic Packaging and Interconnection Series) - edition by John H. Lau, Ricky S.W. Lee. Download it once and read it on your device, PC, phones or tablets. Use features like bookmarks, note taking and highlighting while reading CHIP SCALE PACKAGE, CSP Design, Materials, Processes, Reliability, and Applications (McGraw-Hill Electronic Packaging and Interconnection Series).

 

Product details File Size 16030 KB Print Length 564 pages Simultaneous Device Usage Up to 4 simultaneous devices, per publisher limits Publisher McGraw-Hill Education; 1 edition (March 21, 1999) Publication Date March 21, 1999 Sold by  Services LLC Language English ASIN B000WF0396

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